Since 2007, the competence center nanoeva® acts as a network for inspection & analysis of processes & materials for electronics packaging founded by...

Fraunhofer Institute for Non-Destructive Testing, Dresden branch (IZFP-D)

TU Dresden - Electronics Packaging Lab (IAVT)

TU Dresden - Centre of Microtechnical Manufacturing (ZµP)

...directed by Prof. Norbert Meyendorf (IZFP-D) and Prof. Klaus-Jürgen Wolter (IAVT & ZµP).