About us

Since 2007, the competence center nanoeva® acts as a network for inspection & analysis of processes & materials for electronics packaging founded by...


Fraunhofer Institute for Ceramic Technologies and Systems IKTS

TU Dresden - Electronics Packaging Lab (IAVT)

TU Dresden - Centre of Microtechnical Manufacturing (ZmP)


...directed by Dr.-Ing. Christian Wunderlich (IKTS) and Prof. Dr.-Ing. habil. Thomas Zerna (ZmP).




The nanoeva® field of activities bases on the accepted pillar system...