Motivation

The development of nanotechnology and nanoelectronics is dynamically progressing. This dynamics leads to ever more complex but tinier structures and components, which are processed in packaging technology to complex systems.

In future, micro- und nanointegrated systems will penetrate many areas of our life. The tendency of packaging technology towards three-dimensionally integrated system solutions or multifunctional polymer setups brings about a multiplicity of subsequent process steps in the fabrication of electronic components. It has to be taken into account that more and more technologies and processes from the semiconductor industry are applied in packaging technology, e. g. in order to create tiniest connection structures. Fault-freeness of the functional layers used, which are only a few nanometers thick, is codecisive for the quality of the final product. Comparable to semiconductor production, the failure of a single process step causes the malfunction of the whole product. Packaging technology follows this trend. New technologies are developed to control high-pin count contacts, small distances, high power consumption and high frequencies. Such new technologies with big potential are e. g. system-on-chip (SoC), multi-chip-module (MCM), system-in-package (SiP) and system-on-package (SoP), which can be subsumed under hetero system integration. To introduce the new technologies, in order to develop new production processes and their quality assurance, nondestructive testing techniques are needed which are capable of capturing threedimensional structures with nanometer dimension.