Research & Development Center

To meet the demands of the electronics industry for nondestructive testing methods with resolutions in the sub-micron range, the Electronics Packaging Laboratory of the TU Dresden and the Fraunhofer Institute for Non-Destructive Testing IZFP, Dresden branch, founded the center for nondestructive nano evaluation in electronics packging (nanoeva®). It combines the expertise of both research institutes in the fields of electronics packging technology, quality management, testing methodology, mathematical and physical principles of non-destructive evaluation and of course the application of NDE in electronics packaging to serve the industry as a partner, whose expertise will help to maintain and improve the competitiveness in Germany.

The research and development center can be classified into the following content areas:

• Development and evaluation of new methods
• Construction of prototypes
• Integration & Test in production processes
• Toolbuilding