Research & Development Center

To meet the demands of the electronics industry for nondestructive testing methods with resolutions in the sub-micron range, the Electronics Packaging Laboratory of the TU Dresden and the Fraunhofer Institute for Ceramic Technologies and Systems IKTS, founded the center for nondestructive nano evaluation in electronics packging (nanoeva®). It combines the expertise of both research institutes in the fields of electronics packging technology, quality management, testing methodology, mathematical and physical principles of non-destructive evaluation and of course the application of NDE in electronics packaging to serve the industry as a partner, whose expertise will help to maintain and improve the competitiveness in Germany.

The research and development center can be classified into the following content areas:

  • Development and evaluation of new methods
  • Construction of prototypes
  • Integration & Test in production processes
  • Toolbuilding