Welcome to nanoeva®, the Center of Expertise for testing of processes, materials, components and systems of electronics packaging.

In 2007 nanoeva® was founded as a joint initiative between the former Fraunhofer Institute of Non-Destructive Testing, Dresden branch (German abbreviation IzfP-D, today part of the Fraunhofer Institute of Ceramic Technologies and Systems, IKTS) and the Institute of Electronic Packaging Technology (IAVT) as well as the Centre of Microtechnical Manufacturing (ZmP), which are both institutions of TU Dresden.

The aim of nanoeva® is the pooling of expertise and resources in the field of testing and diagnostics.

Read more about our core expertise.

Here you can find more information about the nanoeva® partners.