Measurement of Bow and Twist

Typ
TDM compact II
Geräteklasse
Geometrical Measurement (dynamically)
Hersteller
Insidix
Anwendung
  • Topography and deformation measurement of PCBs and components during temperature cycle
Eigenschaften
  • Possible objects: PCB, BGA; QFP, DCB; (additional objects on request)
  • Max. object size 300 mm * 200 mm
  • Temperature range -40°C up to 280°C
  • Max. temperature gradient +/- 3 K/s
  • Measurement accuracy in z-direction: 1.5 µm repeatability
  • Resolution vs. FOV (= Field of View)
    • 75 µm @ (150 x 187) mm²
    • 40 µm @ (80 x 100) mm²
    • 15 µm @ (30 x 37) mm²
    • 5 µm @ (10 x 12) mm²
Beispiele