Measurement of Bow and Twist
Device
TDM compact II
Device class
Geometrical Measurement (dynamically)
Manufacturer
Insidix
Application
- Topography and deformation measurement of PCBs and components during temperature cycle
Properties
- Possible objects: PCB, BGA; QFP, DCB; (additional objects on request)
- Max. object size 300 mm * 200 mm
- Temperature range -40°C up to 280°C
- Max. temperature gradient +/- 3 K/s
- Measurement accuracy in z-direction: 1.5 µm repeatability
- Resolution vs. FOV (= Field of View)
- 75 µm @ (150 x 187) mm²
- 40 µm @ (80 x 100) mm²
- 15 µm @ (30 x 37) mm²
- 5 µm @ (10 x 12) mm²
Examples
