Many of our everyday objects are equipped with electronics. Some of them break down too quickly. Especially with safety-relevant or very expensive products, the damage or loss of image is very high. This must be avoided.
The cause of failure of electronic assemblies can have two reasons. Either this is due to an unfavorable geometry of the printed circuit board or the printed circuit board-housing construction or to a mismatch of the thermomechanical properties of the joined materials. In addition, material aging is usually not investigated in detail.
Thermomechanical characterization of the used materials is indispensable for the robust and reliable design of electronic assemblies. With the characterization of the coefficient of thermal expansion (CTE), as well as the temperature- and time-dependent stiffness, essential influencing variables on the reliability can be investigated. This is done by means of thermomechanical (TMA) and dynamic mechanical analysis (DMA).
The measured material data serve on the one hand as a basis for optimal material selection and on the other hand as input data for structural simulation using the finite element method. This is used in conjunction with experimental tests to create service life models so that a robust and reliable product can be created for long warranty periods.