Plasma Treatment
Typ
Dreva Clean 450
Geräteklasse
Plasma equipment
Hersteller
VTD Vakuumtechnik Dresden
Anwendung
- Activating surfaces using oxygen / air / argon (argon+oxygen) / argon-hydrogen / tetrafluormethane-oxygen, t=(0,5 - 30) min
- Surface etching using oxygen and tetrafluormethane / depends on material that shall be etched (condition: material has to be changed to gas phase by process gas), t=(3 - 60) min
- Surface cleaning using oxygen / argon / hydrogen / hydrogen+argon / oxygen+argon / purigon, t=(0,5 - 20) min
- Coating using methane, acetylene, hexafluorethane, octafluorcyclobutane, hexamethyldisiloxane, (process gas = monomeree), t=(5 - 60) min
Eigenschaften
- Low pressure plasma equipment with RF excitation (f=13,56 MHz)
- Process duration (tmax=30 min) and plasma power (Pmax=600 W) adjustable
- Booster pump 65 m³/h, chemcal resistant with oil vapor seperator
- Pressure control with butterfly throttle valve, (0,1 - 1) mbar
- Working pressure p=(20-80) Pa
- 2 MFC for 2 gases, 500 sccm each, mix ratio adjustable
- Process gases: O2, Ar, CF4, N2
- Chamber size (450 x 450 x 500) mm, max. substrate size (300 x 260) mm á 10 pieces stacked
Selection of characteristic applications
- Preconditioning surfaces for adhesive bonding: generating an hydrophilic layer.
- Process gases O2 + Ar,
- Plasma power 400 W,
- Pressure: (25-30) Pa,
- Duration: approx. 1 min.
- Lotus effect: generating an hydrophobic layer
- Process gas: O2,
- Plasma power 400 W,
- Pressure: (25-30) Pa,
- Duration: approx. 1 min.
- Preconditioning of components before soldering:
- Process gas CF4 + (O2 / air)
- Plasma power 400 W,
- Pressure: (25-35) Pa,
- Duration: (10 min)
- Cleaning of Au bondpads:
- Process gases Ar / O2,
- Plasma power (75-100) W / 300 W
- Pressure: 26 Pa / 100 Pa
- Duration: 5 min / 3 min.