Dynamic Mechanical Analysis

Device
DMA Q800
Device class
Thermal Analysis
Manufacturer
TA Instruments
Application
  • Simultaneous measurement of temperature- and time-dependent stiffness (storage and loss modulus) and determination of the glass transition temperature (Tg) of polymer materials
  • Search for well adapted materials dependent to the application
  • Characterisation of ageing effects due to temperature change, humidity/heat, salt fog or media removal
  • Viscoelastic characterisation as input variable for FEM simulations for lifetime models of microelectronic assemblies
Properties
  • Force range: 100 µN - 18 N
  • Force resolution: 10 µN
  • Path resolution: 1 nm
  • Frequency range: 0.01-200 Hz
  • Dyn. deformation range: 0.5 µm bis 10 mm
  • Temperature range: -150 - 600 °C
  • Heating rate: 0.1 bis 20 K/min
  • Cooling rate: 0.1 bis 10 K/min
  • Humidity dependent measurements in the range 5 - 95 % r.H.
  • Load modes
    • Tension clamp
    • Submersion tension clamp
    • 3-point bending clamp
    • 4-point bending clamp
    • Single/dual-Cantileverclamp
  • (Fig. right: upper: DMAQ800 base unit; lower: Chamber for humidity dependent measurements)
Examples
tension clamp
submersion tension clamp
3P-bending clamp
4P-bending clamp
Cantilever clamp
Post-curing effect of an epoxy resin
Frequency behavior polymer materials
Extracted Prony master curve as input variable for FEM structure simulation