High Resolution Computing Laminography

Walk-in CT/HRCL facility
X-ray machine
Fraunhofer IKTS / TISAD GmbH
  • High-resolution, non-destructive inspection of structures and components on or in planar substrates
    (e.g. solder contact analysis on components such as BGAs on printed circuit boards)
  • Error analysis and defect search
  • Quality control
  • Inspection of hidden joints
  • Analysis of constructions
  • Full protection laboratory system according to RÖV
  • 225 kV microfocus X-ray tube, cone beam projection
  • 4 MPixel scintillation detector (2,000x2,000 pixels)
  • High-resolution examination of partial areas of large-area printed circuit boards (up to 3 µm real voxel resolution)
  • No preparation effort for high resolutions (compared to standard CT)
  • Particularly suitable for failure analysis of solder contacts of Chip components, BGAs, QFNs, QFPs etc.
X-ray tube with rod anode above the BGA of a printed circuit board
Crack through the interposer of a BGA
3D visualization of a BGA contact riddled with cracks and voids
2D view of a 100% crack in a BGA contact