X-ray microscope
Typ
nanome|x
Geräteklasse
X-ray equipment
Hersteller
GE Sensing & Inspection Technologies GmbH
Anwendung
- Non-destructive inspection of components and modules, especially out of high contrast materials (solder, metal layers etc.)
- Failure analysis and defect identification
- Quality control
- Inspection of hidden interconnects
- Analysis of assemblies
Eigenschaften
- Inherent protection X-ray equipment accord. RÖV
- High resolution vertical and oblique view up to 70° radiography
- Open nanofocusTM tube with diamond target
- Acceleration voltage 10 - 160kV / 15W, beam current 5 - 880 µA
- Specimen movement in 5 axis
- High resolution real-time image chain and alternatively digital detector
- CCD camera 1126 x 1600 Pixel, 12 Bit
- Digital detector 1000 x 1000 Pixel, 14 Bit
- Geometrical magnification > 1.000x
- Min. details recognition: 400 nm
- Additional feature laminography
- Additional feature tomography

Beispiele
QFN on PCB, radiography

Same QFN, laminography

Same QFN, tomography, 3D model

Radiography of micro processor module, PGA

Radiography, double-sided assembled BGA
