X-ray microscope

Typ
nanome|x
Geräteklasse
X-ray equipment
Hersteller
GE Sensing & Inspection Technologies GmbH
Anwendung
  • Non-destructive inspection of components and modules, especially out of high contrast materials (solder, metal layers etc.)
  • Failure analysis and defect identification
  • Quality control
  • Inspection of hidden interconnects
  • Analysis of assemblies
Eigenschaften
  • Inherent protection X-ray equipment accord. RÖV
  • High resolution vertical and oblique view up to 70° radiography
  • Open nanofocusTM tube with diamond target
  • Acceleration voltage 10 - 160kV / 15W, beam current 5 - 880 µA
  • Specimen movement in 5 axis
  • High resolution real-time image chain and alternatively digital detector
  • CCD camera 1126 x 1600 Pixel, 12 Bit
  • Digital detector 1000 x 1000 Pixel, 14 Bit
  • Geometrical magnification > 1.000x
  • Min. details recognition: 400 nm
  • Additional feature EDX
  • Additional feature EBSD
Beispiele
QFN on PCB, radiography
Same QFN, laminography
Same QFN, tomography, 3D model
Radiography of micro processor module, PGA
Radiography, double-sided assembled BGA